Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free Solder Joints
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Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
متن کاملInvestigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
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As concerns of the environmental impact of lead waste increase, the electronics industry is coming under increasing pressure to reduce or eliminate the use of lead in their manufacturing processes. Circuit assembly providers consequently must develop alternatives to eutectic tin-lead solder for use in their operations. Many ramifications are likely, including an initial decrease in process yiel...
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Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization process is critical to the lead-free (Pb-free) solders that are replacing lead-based (Pb-based) solders. In this study, drop impact solder joint reliability for plastic ball grid array (PBGA), very-thin quad flat no-l...
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In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...
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